Events

Upcoming Events

Technology Roadshow for 3D Technology, MEMS and Advanced Packaging

3D integration of microelectronic devices, MEMS and Wafer-Level Packaging have developed into key enabling technologies for future electronic products. SUSS MicroTec, Surface Technology Systems (STS), NEXX Systems and our seminar guests are at the forefront of developing equipment and process solutions for these exciting technologies. This roadshow will provide a comprehensive overview of new developments in the field of Through-Silicon-Via (TSV) processing, 3D Lithography, wafer-level bonding as well as new packaging technologies such as C4NP and Resin-Core Bumping for COG. 

FOR MORE DETAILS AND REGISTRATION GO TO :  www.3dintegration.org

2007 Exhibitions

STS participates in a number of exhibitions throughout the year, for more details click on the exhibition name.