Products / Process Modules

Process Modules provide the processing component of any STS system. Each process module has been developed for specific applications in mind, utilising STS technology and expertise. Any of the following process modules can be configured to any of the above STS platforms:

• Pegasus - DRIE source with highest silicon etch rate, smoother sidewalls, excellent cross-wafer uniformity and reduced feature "tilting" effects
• ICP - conventional Inductively Coupled Plasma source for DRIE of silicon or etching of compound semiconductors, dielectrics, metals, or polymers
• APS - ICP-based plasma source specifically for etching materials which are difficult to etch in conventional ICP sources
• CVE - Chemical Vapor Etch using XeF ₂ to isotropically etch silicon, without plasma excitation
• PECVD - Plasma enhanced chemical vapour deposition of high quality, doped/undoped, organic/inorganic thin films