Markets / Micro Electro Mechanical Systems

Processing of MEMs devices covers a wide range of applications and materials, and tailoring of processes is essential to the success of the device. Understanding the contribution of process and equipment design to the results is fundamental to achieving the optimum results. STS has the experience and strives to continually enhance its products, to move forward and meet the challenges of tomorrow’s device requirements.

Key Processing Challenges

• Faster etch rates – to reduce process times and costs
• Smooth sidewalls
• High aspect ratio etching
• Etching to etch stop layers (membranes, SOI, glass)
• Handling of thin and fragile wafers
• Deposition of stress-free membranes

Experience gained over the last 15 years has enabled STS to develop processes that tackle the most complex device design issues. STS’ competitive advantage for MEMS deep reactive ion etching (DRIE) of silicon lies in its unique proprietary ASE^® Process technology enhancements.

STS' patented SOI technology overcomes the problem of notching at Si : insulator interfaces and Parameter Ramping enables the process conditions to be altered over a time period enhancing CD/profile control, high aspect ratio etching, smooth sidewalls as a few examples.

In addition to the market-leading DRIE technology, for which STS is so well-known, the company also offers other process technologies utilized for MEMS manufacturing, such as PECVD, ICP and dry release etching using XeF₂ .
STS maintains established strategic relationships with other MEMS equipment suppliers to offer a ‘value-add’ service to customers by increasing our processing footprint within the industry. These include:

• Primaxx, Inc. for HF/Methanol vapor etch of SiO₂
• XACTIX, Inc. for XeF₂ systems for R&D applications