MACS

The MACS (MPX Atmospheric Cassette System) Platform has been developed for pilot production or small volume applications, and is compatible with the complete range of STS process modules:

• Pegasus (Deep Reactive Ion Etch, typically 30% higher etch rate than HRM)
• HRM (High rate Deep Reactive Ion Etch)
• ICP (Inductively Coupled Plasma) Etch, including standard rate DRIE
• XeF₂ (Chemical Vapour Etch, using XeF₂)
• PECVD (Plasma Enhanced Chemical Vapour Deposition

Key Features include:

• Single process chamber plus a MPX vacuum loadlock with an additional cassette-to-cassette handling system for automatic processing of up to 50 wafers
• Offers throughput equivalent to single process chamber cluster tool, for significantly less capital cost, reducing cost per wafer.
• Wafer size 3 inch to 200mm
• Optional wafer aligner
• Wafer mapping at cassette, robot and load-lock
• Flexible Windows software - multiple recipes for each cassette
• Small footprint
• Range of optional clean room interface panels
• Installed base of over 80 systems