LPX

The LPX platform combines a manually-loaded, fully automatic single wafer vacuum loadlock with any of STS' etch or deposition plasma sources to produce a low-cost platform for low volume or R&D applications.

Key Features

• Compatible with all STS market-leading etch and deposition process chambers, including:
• Pegasus - Deep Reactive Ion Etch (DRIE) source, typically 30% higher etch rate than HRM
• HRM - High rate DRIE
• ICP - Inductively Coupled Plasma etch, including standard rate DRIE
• XeF₂ - Chemical Vapour Etch, using XeF₂
• PECVD - Plasma Enhanced Chemical Vapour Deposition
• Small footprint, with modular parts to allow ease of access and flexible arrangement of components such as electronics rack, chillers and pumps
• Small loadlock volume (<8litres), for faster evacuation (<40secs) and vent to atmosphere (<60secs)
• Manual loadlock
• MESC/SEMI E21-94 rectangular transfer gate for transferring wafers (2" to 200mm)
• Choice of mechanical or electrostatic clamping
• Reliable PLC-based control system with Windows-based user interface for fully automatic operation, including:
• Direct manual control while maintaining safety-critical interlocks
• Flexible job scheduling
• Password protected operator and engineering levels
• Full data logging.
• Remote monitoring, fault diagnosis & recipe editing.