CPX

The CPX platform, launched in September 2005 to replace the ASPECT cluster system, has been developed for high volume production applications, and is compatible with the complete range of STS process modules:

Key Benefits & Features

High productivity

• Four available process facets
• Option for Bisymmetrik arm (two end effectors)

Production proven hardware

• STS proven advanced, reliable ,PLC and
• DeviceNet control system
• Brooks Marathon Express wafer transport module
• Small footprint
• Clean room interface

Easy maintenance

• Fast turn-around

State-of-the-art design concepts

• Modular design - more control hardware on-board
• Windows GUI
• Single point facilities hook-up

High specification platform

• 76mm - 200mm wafer sizes
• Twin vacuum cassettes with autosliding doors
• wafer mapping, cross slotting and wafer slide out detection
• Integrated low contact wafer alignment

Flexibility with integration of all STS advanced process modules

• Pegasus - highest rate source for silicon DRIE
• HRM - high rate source for silicon DRIE
• ICP (Inductively Coupled Plasma) Etch including switched (DRIE) and non-switched processing
• APS (Advanced Planar Source) for oxides and carbide etching
• PECVD (Plasma Enhanced Chemical Vapour Deposition)
• XeF₂ (Chemical Vapour Etch, using XeF₂) for isotropic silicon release etching