Advance Packaging

STS work with a number of customers involved in developing innovative Advanced Packaging solutions, providing a range of process capabilities which are used at specific steps in the manufacturing route.

By using our in-depth knowledge of the MEMS market and packaging challenges faced by MEMS manufacturers, STS has provided key process steps which may be utilised in a wider range of packaging applications.

These include:

• PECVD of encapsulating layers
• Dry isotropic etch of sacrificial layers
• Through-wafer interconnects
• Controlled profile silicon etch

Key challenges

• Reducing die size and increased packing
• Reducing cost of packaging
• Maintaining protective atmosphere for device
• CMOS-compatibility