Technologies

Ready for the Next Generation Resists

The inherent cost advantage, flexibility, and ease or use of SUSS lithography systems make them extremely attractive solutions for a wide range of thin and thick resist applications. SUSS MicroTec lithography systems have been proven especially well suited for production processes with standard photoresists, as well as for applications where either the resist thickness or wafer topography ranges up to several hundred microns. With polymers, such as BCB or photo-sensitive polyimides SUSS lithography equipment yields excellent results especially for advanced packaging applications. The most important advances in thick resist processing come from new resist materials that allow for improved patterning results.

Read more about:

  Standard Photoresists

  Thick Photoresists / New Resist Materials

  High Topography(3D)

  Polyimide Processes