FR3200 Wafer Inspection and Automated Defect Review System

"The 248nm Deep UV optics set new standards for inspection and defect review by providing unparalleled resolution and contrast. This is accomplished through the use of Olympus’ patented Air Gap design technology using Fluorite (CaF2) and Quartz to provide superior transmittance."

Rapidly decreasing feature sizes on semiconductor wafers have created a need to further extend the resolution limit of optical inspection. The FR3200 wafer inspection and defect review system answers this need by integrating 248nm Deep UV optics with a broad range of visible light imaging methods. This next generation inspection and review system uses DUV to increase the resolution limit of standard optical inspection systems to 0.08 um.

High Speed Wafer Handling for 200 and 300mm Operation
The FR3200 provides 200 and 300mm wafer inspection and automated defect review in a single system with minimal footprint. A flexible load port configuration makes the system adaptable to any manufacturing layout requirement. The system can be configured with any combination of SEMI-E63 Bolts-M compatible load ports; it can be configured so that the tool has 200 and 300mm capability simultaneously. High speed robotic wafer handling ensures high throughput. The integrated mini-environment ensures contamination free processing in better than Class 1 conditions. The system is SEMI S2 and S8 compliant, CE Marked and can be seamlessly integrated into automatic factory standards through implementation of SECS/GEM (SEMI E30.1).

Macro Inspection - Front and Backside in a Single Pass
Olympus is the only company that provides a tool with both front and back macro inspection in a single pass. Backside macro can accommodate center and/or edge observation. The macro inspection unit, with a responsive joystick controller allows users to tilt, rotate and register positions on the wafer. A full complement of inspection light sources are available to satisfy the most demanding of inspection requirements.

Micro Inspection
Microscopic observation techniques include bright field, dark field, DIC, confocal, DUV and DUV confocal, allowing the user to observe inspection points and defects under a wide variety of magnifications and illumination. A tracking laser auto focus keeps the wafer focused in all observation modes. Images of the wafer are displayed in a live video window. The inspection software application allows the user to program and store specific inspection sequences for specific products and processes. Images and other information can be stored as part of the inspection sequence.

Defect Review with Automatic Defect Classification
The FR3200 is delivered with manual and automated defect classification software. Defect maps for patterned or bare wafers are imported from various inspection or yield management tools and the Automated Defect Review application will use this information to automatically generate a wafer map, align the wafer and navigate to defect sites. The Automatic Defect Classification (ADC) software will image and classify each defect. The defect file is updated with the defect image and classification information and the file can be automatically exported to the Fab yield management system if desired.

Related Information
Product Overview (English, 1.2MB, .pdf )

Application Note 111202v1:
Trench Etch Qualification using Deep UV (English, 240KB, .pdf )

Application Note 111802v1:
Post Poly Etch Residue Detection & Monitoring using DUV (1.44MB, .pdf )