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Rezi-38

BAKER REZI™–3X Series of Residue Removers

The BAKER REZI-3X series of residue removers are greater than 80% aqueous and compatible with aluminum, copper, silicon dioxide and low-  dielectrics. These products are effective on the removal of etch/ash residue and sidewall polymer from metal and via structures. The BAKER REZI-3X series of residue removers are highlighted below.

BAKER REZI-37 RESIDUE REMOVER

  • For convenience in bath preparation, BAKER REZI-37 residue remover is designed for a 1:1 dilution with 3.25% hydrogen peroxide.
  • The dilution recipe for BAKER REZI-37 residue remover is 1:1 (BAKER REZI-37 residue remover with BAKER REZI-37 activator, product number 5848-05 (3.25% H2 O2 solution)).

BAKER REZI-38 RESIDUE REMOVER

  • Ideally suited for single wafer tools and Cu processes. Flexible dilution ratios allow for process specific customization.
  • Suggested dilution recipe is 20:1 (BAKER REZI-38 residue remover with 30% hydrogen peroxide). Recommended hydrogen peroxide is J.T.Baker® product number #5846-03 or product number 2190-03.

BAKER REZI-39 RESIDUE REMOVER

  • A wetting agent is added to BAKER REZI-38 residue remover to effectively remove residue from high aspect ratio features such as vias and other very small geometries.
  • BAKER REZI-39 residue remover has the same  exibility in dilution ratios as BAKER REZI-38 residue remover. See above for details on suggested dilution recipe.

CHARACTERISTICS OF BAKER REZI-37, BAKER REZI-38, AND BAKER REZI-39 RESIDUE REMOVERS:

  • Environmentally friendly chemistry for etch/ash residue and sidewall polymer removal—formulations are greater than 80% aqueous
  • Compatible with aluminum, copper and most low-  dielectrics
  • Designed for use in a spray tool, bath system or single wafer tool
  • Short operating times—30 to 90 seconds for a single wafer
  • Low operating temperatures—starting at 20°C
  • Designed to provide broad process latitude in terms of processing time and temperature
  • Long bath life—typically greater than 24 hours
  • 100% water soluble formulations—no intermediate solvent rinse required resulting in decreased total process time and costs
  • Does not contain  uoride or hydroxylamine

Untreated metal lines

After treatment with BAKER REZI-38 residue remover in bath at 22°C for 10 min

0.25 µm metal lines treated with BAKER REZI-38 residue remover show complete removal of sidewall and surface polymer.

Untreated, 0.18µm, high aspect ratio vias (5:1) from a 300 mm wafer, etch stopped on top of TiN with Al-Cu metallization below

After treatment with BAKER REZI-39 residue remover in bath at 65°C for 20 min

The high aspect ratio vias treated with BAKER REZI-39 residue remover are completely cleaned of residue.

Click here to view more details on the Rezi-38

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