CLk-222 Photoresist Stripper & Residue Remover - Mallinckrodt Baker, Inc. - Semiconductor International Technology Library

Mallinckrodt Baker, Inc.

CLk-222

BAKER CLk™-222 Photoresist Stripper and Residue Remover

BAKER CLk-222 photoresist stripper and residue remover is an aqueous cleaning product engineered for efficient removal of bulk photoresists, anti-re ective coatings and post ash residues created during dual damascene wetlow- dielectrics. BAKER CL -222 photoresist stripper and residue remover removes the sacrifical anti-re ective coating and bulk photoresist in a single step.

CHARACTERISTICS:

Efficient bulk resist and ash residue remover providing results in 5–30 minutes
Compatible with copper and low- dielectrics
100% water soluble formulation—no intermediate solvent rinse required—resulting in efficient processing times and lower costs
Designed to provide broad process latitude in terms of processing time and temperature
Long bath life—typically greater than 24 hours
Does not contain fluoride

Untreated

After cleaning with BAKER CLk-222 photoresist stripper and residue remover,
55ºC, 30 minutes

TECHNICAL INFORMATION

Metal Etch Rates (Å/min) at 65ºC

Cu	Ta	W
<1	<1	<1

Metal Etch Rates (Å/min) at 65ºC

SiN	SiC	TEOS
<1	<1	<1

Compatibility Information
Low- k Dielectric Etch Rates (Å/min) at 45ºC

General CDO	CORAL1	Black Diamond2 II	FSG	SiOC
<1	1	<1	<1	<1

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