Thick Photoresist

JSR's unique THB series of negative tone resists address the needs of metal plating and bumping processes using a proprietary design that incorporates a polymer backbone with multifunctional acrylate groups.

Excellent plating tolerance and ease of stripping allow JSR THB negative tone photoresists to provide fast processing with excellent exposure throughput and superior process margins. The acrylate groups in our THB series resists cross-link on exposure and are developable in standard TMAH yielding high aspect ratio profiles for film thicknesses from 10 to 100 m m. Contact your local JSR sales representative for a "One-on-One" discussion about these innovative materials.

Product   Film Thickness (mm)   Application
THB 110N  5-15  Copper wiring
THB 132N  15-30  Copper Wiring
THB 151N  30-100  Copper, Solder bump

THB 110N

Reroute for Copper Plating
for Wafer Level CSP
System in Package

Post Copper Plating
and Resist Strip

THB 132N

Reroute for Copper Plating for Wafer Level CSP System in Package