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Top Antireflective Coatings

Features

  • Excellent defect control
  • Improved process latitude
  • Reduced swing ratio by a factor of 3
  • N=1.41 @ 633nm
  • 440A @ 2500 rpm

NFC540 Process Integration

  • NFC540 application step done following resist application and bake
  • No soft-bake of NFC540 required
  • NFC540 must be rinsed off with DI water prior to contact with developer solution
    		•  
    Resist Application

    Soft-bake

    Chill

    NFC540 Application

    Exposure

    PEB

    Chill

    DI Rinse & Develop

    Mechanism of TARC Process

    Swing Curve of NFC540 with KrF Resist

    Improved Process Latitude with TARC

    Structure JSR KrF Resist JSR KrF Resist w/NFC540
      Max DOF(um) Max EL Max DOF(um) Max EL
    A 0.55 21.9% 0.57 17.9%
    B 0.45 20.9% 0.54 18.2%
    C 0.34 16.8% 0.40 21.3%
    D 0.48 16.2% 0.60 13.8%
    Common Window 0.39 18.2% 0.46 18.0%

     

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