Low-K Dielectrics - JSR micro - Semiconductor International Technology Library

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Low-k Dielectrics

JSR Spin-on Dielectric Materials Line Up

General Trends - E-beam vs. Thermal Cure

Process diagram of JSR LKD

3LM Lot & Package Results

All spin-on DD stuck build

JSR Spin-on Dielectric Materials Line Up

General Trends - E-beam vs. Thermal Cure

General Trends - E-beam vs. Thermal Cure

3LM Lot; 0.3 mm Via Chain

Package Results; Gold Wirebond II

Structure to support packaging activity to mimic real-world integration.

Successful wire bonding and solder bumping (high yield and pull/shear strengths).

M3 was patterned with M2 (775 level) mask in ATDF with good overlay.

TEM Image

All spin-on DD stuck build

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