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Advanced CMP consumables for 32nm generation

Background

  • Narrower pitch Cu wiring and fragile Low-k materials will be extensively used for next generation technologies.
  • Such structures will be more sensitive to mechanical friction.


“Soft polish” will be required to prevent mechanical damage.

Required scheme of Barrier CMP


Control of Low-k RR is very important for barrier CMP of Cu/Low-k process.

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