FSI International Expands Its Technology Portfolio for Advanced High-k Gate Applications with Allowance of a New Patent

FSI received Notice of Allowance from the U.S. Patent and Trademark Office for a surface preparation method of forming an ultra-thin silicon oxide layer required prior to deposition of a high dielectric constant (high-k) film. This patent broadens FSI’s technology portfolio to further address the needs of IC manufacturers when implementing high-k technology in the fabrication of 45nm and 32nm devices. more >>

FSI International Receives U.S. Patent for Method of Combining Uniform Etching with Rinsing and Drying in a Single Immersion Tank

Advancement Targets FEOL 65nm and 45nm Production to Deliver Industry-Leading Etch Performance.

U.S. Patent and Trademark Office has awarded the company a patent for a method which produces ultra-uniform etch results in combination with a rinse/dry step in a single immersion tank for front-end-of-line (FEOL) critical cleans. This advancement is part of FSI’s SymFlow™ technology and is integrated with FSI’s exclusive surface tension gradient (STG®) rinse/dry process for use in the MAGELLAN® Immersion Cleaning System. more >>

FSI International, Inc. Announces Third Quarter and First Nine Months Fiscal 2007 Financial Results

Sales for the third quarter of fiscal 2007 were $25.2 million, compared to $32.0 million for the same period in fiscal 2006. The Company’s net loss for the third quarter of fiscal 2007 was $5.6 million, or $0.19 per share, compared to a net loss of $2.4 million, or $0.08 per share, for the third quarter of fiscal 2006. more >>

Chartered Semiconductor Describes BEOL Applications of ANTARES® System Cryokinetic Aerosol Cleaning Process

At the April FSI Knowledge Services Seminar™ Series in Singapore and Shanghai, China, Ms. Ling Tze Tan of Chartered Semiconductor Manufacturing described applications of the ANTARES® cryokinetic aerosol cleaning tool in 90nm BEOL production. Her presentation focused on cleaning after via etch and after dielectric film deposition reflecting a growing widespread concern in the industry about the potential for water and chemical damage to copper and porous dielectrics. more >>

Samsung Presents Results of ViPR™ Process Joint Development Project

At the April FSI Knowledge Services™ Seminar held in Seoul, Korea, Mr. Kwang Wook Lee of Samsung Electronics presented the results of a year-long joint development project to evaluate and improve the performance of FSI’s ViPR™ all wet stripping process on photoresist used in high dose implant processes. The JDP focused on plasma doping applications and successfully qualified the ViPR™ process for increased stripping capability, reduced material loss, and better electrical characteristics. For photoresist stripping after plasma doping, polysilicon loss was reduced by 50%, dopant loss was reduced by 40%, process steps were reduced from 3 to 1, and cycle time was reduced by over 70%. more >>

First High Throughput MAGELLAN® System Shipped for Production

The first MAGELLAN® immersion cleaning system on the new high throughput platform has been shipped for use in several production applications at a major logic and memory manufacturer in the US. The MAGELLAN® system has seen widespread acceptance, with the number of installed systems doubling in the last two years. Currently tools are installed in all three major manufacturing regions, Asia, Europe and North America, in both logic and memory fabrication, and in 65nm production and 45nm development applications. more >>

More than 350 Asia IC Makers Learn About the Latest in Surface Preparation Technologies -- and tell us about their top cleaning challenges

In April 2007, FSI held yet another successful Knowledge Services™ Seminar Series (KSS) in Asia. Over 350 IC makers attended our KSS sessions in Seoul, Singapore, Beijing, Shanghai, Hsinchu and Tainan.

FSI customers continue to tell us this is a day very well spent. Not only did attendees learn about the broad capabilities of FSI technology solutions, but they gained perspective on industry trends, peer-company challenges and solutions, while enjoying a technical short course from leading industry professors. more >>

FSI welcomes Jame Chu (Ming Mao), field applications engineering manager

FSI is very pleased to welcome James Chu to FSI as field applications engineering department manager for Southeast Asia and Greater China. more >>

FSI expands customer support by opening another office in Taiwan

For several years, FSI has provided full-service customer support operations in Taiwan from its Hsinchu office. Due to the continued growth in Taiwan and the desire to strengthen its customer responsiveness and support offerings, FSI recently opened a new office in Tainan. The Tainan operations include field service and applications engineering and logistical support capabilities. more >>

"Wafer Cleaning and Surface Prep: Evolution to Revolution" published in Semiconductor International, April 2007

Please visit the FSI Technical Library to view the latest papers available on FSI technologies

SEMICON West 2007

FSI International is not exhibiting at SEMICON West 2007. Please contact your local account manager if you have questions or would like to schedule a meeting to learn about FSI’s surface conditioning solutions.

SI China Wafer Cleaning Seminar

Andy Romano, FSI Global Product Manager, Batch Spray Systems, will present “Batch Spray Processing for Superior Photoresist Stripping and Film Removal” at the SI China Wafer Cleaning Seminar on August 9, 2007 at the Riverfront Business Hotel in Shanghai. For more information on this seminar, visit the Semicondutor International China website.

m•FSI Presents at Electronic Journal 160th Technical Symposia in Tokyo, Japan

Kazuhiro Miura, FSI products division business coordinator for *m•FSI LTD, will present “FSI and m•FSI Wet and Dry Cleaning Processes” at the Electronic Journal 160th Technical Symposia in Tokyo, Japan, August 29, 2007. For more information on this symposia, visit the Electronic Journal website.

*m•FSI is FSI’s Japanese-based distributor. m•FSI supports the Japan market with its own engineering, development, sales and marketing, and customer service departments. mFSI maintains a website at http://www.mfsi.co.jp/

212th ECS Meeting

Listen to FSI present on the following Topics at the 212th ECS Meeting, October 7-12, 2007, Hilton Washington, Washington DC:

• Monday, October 8, 2007 at 14:30 "Yield Improvement Using Cryogenic Aerosol for BEOL Defect Removal" J. Lauerhaas (FSI International), L. Tan, A. Hamzah (Chartered Semiconductor Manufacturing, Ltd.), Y. Kok and J. Kwang (FSI International)
• Tuesday, October 9, 2007 at 14:20 "Wet Resist Strip Capability vs. Implant Energy" K. K. Christenson (FSI International)

For more information on this seminar, visit the ECS website.