ANTARES^®

Light years ahead for better yield today

ANTARES^® Cryokinetic Cleaning System

Some leading IC manufacturers climb the yield curve faster than others, and one reason for their success is the ANTARES® System. The ANTARES® System allows customers to remove defects more effectively and apply in places not addressable by traditional methods of particle removal. Typical ROI results in 1 to 3 months.

• Particle removal with the all-dry, non-reactive, and brushless CryoKinetic technology
• Safe and effective on sensitive new materials such as Cu and low-k, unlike wet and scrubber methods that can alter material properties
• More effective in particle removal than scrubbers in customer comparison

Applications:
FEOL and BEOL particle removal

Available configurations:

• Fully automated 300mm (bridging to 200mm)
• Fully automated 200mm (bridging to 300mm)