EV Group SEMICON West 2008 Product Preview
GEMINI®/EVG560

North Hall Booth #5429

The GEMINI^® platform is EV Group’s field-proven, production manufacturing solution for high-volume wafer bonding applications for MEMS, 3D integration and advanced packaging, as well as compound semiconductor applications.

With more than 100 automated wafer bonder installations worldwide integrated with the field-proven EVG500 bonding chamber, the GEMINI^® is designed for the lowest total cost of ownership and quickest return on investment.

The tool is 300mm-ready and incorporates EV Group’s patented SmartView^® bond alignment principle, as well as up to four wafer bond chambers, capable of achieving post-bond alignment accuracies in the sub-micron range.  The SmartView^® bond aligner is also able to perform high-precision aligned direct bonding without the necessity of transferring the aligned wafers to a separate high-force bond chamber.

The bond chambers, designed for a plug-and-play upgrade in the field, are equipped with a high-force bond head up to 60kN; double-sided heating up to 600°C; a 40°C ramp rate for heating and cooling; high-vacuum capability down to 1E-5mbar; as well as a unique low-force wedge compensation system.

The system can directly handle thin wafers down to 200µm, however, the handling concept can be combined with EV Group’s thin-wafer carrier handling technology that is capable of handling wafers down to 50µm mounted temporarily on wafer carriers.

The tool can be configured with optional pre-bond process modules like megasonic DI-water cleaning, intermediate bond layer coating or low temperature plasma activation, as well as post-bond process modules like high-resolution IR inspection.