Integrated Systems Integrated Systems for Advanced Packaging, 3D Interconnect
Wafer level packaging technologies that require precise wafer alignment and bonding for stacking of wafers can be integrated to allow faster and high-performance production. With a maximum integration level, a cost effective production output is achieved. EVG's integrated systems represent a unique solution for all processes including lithography techniques up to 300 mm wafer size or wafer-to-wafer alignment and wafer bonding and are all performed in a small footprint automated manufacturing solution. Integrated Systems for Compound Semiconductors and Silicon-based Power Devices
The manufacturing steps of compound semiconductor devices are process-intensive operations. EVG's integrated systems provide manufacturers with the ability to streamline production through the use of all-in-one production systems. Our integrated systems combine latest lithography technology in an efficient, step-saving production solution. Eliminating down-time and waiting times saves production cost and increases efficiency. Integrated Systems for MEMS
EVG offers production systems with a maximum level of integration for faster processing speeds and increased production output. In volume MEMS production, costs can be dramatically reduced by an integration and automation of essential process steps. Integrated lithography techniques performed with coat/bake - align/expose - develop configurations or wafer-to-wafer alignment and wafer bonding capabilities result in a decrease of capital equipment cost and save additional handling time as operator interaction is reduced to a minimum. | 
