|
Event |
Location |
Details |
URL |
| SEPTEMBER |
| 9-11 |
Semicon Taiwan 2008 |
Taipei, Taiwan |
Hall 1
Booth 1082 |
http://www.semicontaiwan.org |
| 15-18 |
MNE - Micro Nano Engineering 2008 |
Athens, Greece |
Poster Presentation by Thomas Glinsner;
Poster Session I; Thusdays, 16th 4-6:30 PM “The Use of Working Stamps in Nanoimprint Lithography as an Enabling Technology for Industrial Applications” |
http://www.mne08.org |
| 25 |
Sematech Conference Manufacturing and Reliability Challenges for 3D ICs using TSVs |
San Diego, CA |
Poster Presentations by Matthias Thorsten; 12:30-2:30 PM; Turf Club, Del Mar Fairgrounds a) “Failure mechanisms of wafer bonding” b) “Processing of thin wafers using a carrier wafer and temporary bonding and
debonding” |
www.sematech.org |
| 28-30 |
MME - MicroMechanics Europe 2008 |
Aachen, Germany |
|
http://mme2008.de |
| OCTOBER |
| 7-9 |
Semicon Europe 2008 |
Stuttgart, Germany |
Hall 1
Booth 1304 |
http://www.semiconeuropa.org |
| 13-15 |
NNT 2008 - 7th Nanoimprint and Nanoprint Technology Conference on Miniaturized Systems for Chemistry and Life Sciences |
Kyoto, Japan |
Paper Presentation by Thomas Glinsner, Tuesday, 14th, 3:30-5:30 PM, Room B-2 “Soft UV-NIL enables Industrial Applications” |
http://nanoimprint.jp/nnt08 |
| 12-17 |
PRIME 2008
ECS Fall Meeting |
Hawaii, Honolulu |
Poster Presentations by Viorel Dragoi, Tuesday 14th; 4:20 PM, Coral Exhibition Hall a) “Plasma activation for low temperature wafer bonding”
c) “Effect of Process Variables on Glass Frit Wafer Bonding in MEMS Wafer Level Packaging” Paper Presentation by Dragoi Viorel, Thursday 16th, 4:30 PM; Room 306 A, Level 3 b) “Microring Resonators Fabrication by BCB Adhesive Wafer Bonding” |
http://www.electrochem.org |
| 10/13/2008 |
IWLPC - International Wafer-Level Packaging Conference 2008 |
San Jose, USA |
|
http://www.smta.org/iwlpc |
