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EVG®850 Fully-Automated Temporary Bonder/Debonder
The EVG850TB/DB system enables processing of thin and ultra-thin wafers, allowing secure and reliable handling of high value wafers in combination with highest yield improvement, which is a key factor for future power device applications, consumer appliances and other semiconductors markets. The new tool offers increased process flexibility as it allows for automated handling, cleaning, lamination and bonding of a back thinned device wafer to carrier wafers with different intermediate materials dedicated for temporary bonding. The growing need for thin wafers, e.g. in order to reduce device power consumption, requires special processing techniques including temporary bonding of wafers to a carrier substrate and debonding of thin and ultra-thin wafers after back-grinding and further processing steps.