Post-CMP Cleans - Air Products - Semiconductor International Technology Library

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Post-CMP Cleaning Chemicals for Advanced Integrated Circuits

Post-CMP cleaning products are high performance materials specifically designed to remove trace metal and particle contaminants deposited by the CMP process without etching or corroding the metal surfaces or the dielectric substrates. CoppeReadyTM CP72B is an acidic, non-fluorinated, high performance copper/low-k CMP cleaning solution. CoppeReady CP72B was engineered specifically to remove trace metals, organics and particle contaminants from copper, tungsten, tantalum/tantalum nitride and hydrophobic low-k surfaces deposited during the CMP process. CoppeReady CP72B can be used for pad cleaning to extend pad life by two to three times.

Our CoppeReady CP72B is specifically designed to meet all copper post-CMP cleaning requirements:

Low cost of ownership
No water-mark formation
Excellent general and galvanic corrosion protection for copper lines
Complete removal of organic inhibitor residues
Avoidance of heavy copper oxide formation
Excellent particle removal efficiency
Compatibility with low-K materials
Excellent removal of trace metals from the wafer surface
No Cu dendrite/bridge formation
Improvements in e-test performance
No microbial growth during storage/transportation

Our CoppeReady CP74 is an alkaline cleaning solution made specifically for STI cleaning.

These post-CMP cleans are part of the CoppeReadyTM product line which includes products for the entire copper CMP process, from copper plating and cleaning to copper CMP and post-CMP cleaning.

To download the latest datasheet, enter our product catalog from the home page of our site.

A VARIETY OF FORMULATIONS TO MEET YOUR COPPER POST-CMP CLEANING NEEDS.

Cost-Effectiveness. Performance. Purity.

CMP Cleaning Solution in use on a wafer

These factors are what separate our post-CMP cleaning products from the rest of the pack.

Air Products has developed proprietary Chemical Mechanical Planarization (CMP) cleaners, surface conditioners, and pad cleaners to meet the increasing demands created by advanced technology integration roadmaps.

Our versatile CoppeReady™ product line includes a series of application-specific products that are designed to reduce the customer's overall cost of ownership while providing leading edge cleaning performance. CoppeReady™ CP74 and CP72B are just two of the products which "deliver the difference."

Through our relationships with industry leading OEMs and advanced device manufacturers, Air Products has leveraged its R&D and Material Science capabilities to understand customer challenges and provide solutions for technologies at 65nm and beyond.

To download the latest datasheets, enter our product catalog from the home page of our site.

Clean Chemistry	CP72B	CP74
pH	Acidic	Alkaline
Wetting of hydrophobic surfaces	Excellent	Excellent
Particle removal from metal surfaces and low-k dielectrics	Excellent	Excellent
Prevention of water marks on low-k dielectrics	Excellent	Best
Ability to remove Cu(l)-BTA complex from metal surfaces	Total	Total
Prevention of formation of copper oxides after cleaning	Excellent	Excellent
Ability to remove trace cations and anions	Best in class	Best in class
Galvanic corrosion resistance of Cu	Complete protection of Cu against variety of barrier layers	Complete protection of Cu against variety of barrier layers
General/pitting corrosion resistance	Excellent	Excellent
Pad cleaning ability	Excellent	None

For more information on our post-CMP cleaning products, please contact:

Paul Nemesh
New Product Development Manager
nemeshpg@airproducts.com

Sherry Chen
Marketing Manager
chenxs@airproducts.com

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